Inline Visual Dispensing Machine for Wire Bonding Gold Wire Encapsulation
The GS600M Inline Visual Dispensing Machine is a precision-engineered inline dispensing solution designed to meet the ultra-high requirements of gold wire encapsulation in advanced wire bonding applications.
Equipped with a high-resolution visual alignment system, the GS600M detects fine wire positions and calculates optimal dispensing paths in real time. Its advanced low-level alarm module prevents unexpected interruptions by monitoring fluid levels and ensuring consistent glue supply throughout production.
The GS600M supports both single-valve micro-dispensing for precise adhesive control and double-valve configurations for higher throughput where needed. Its rigid mineral cast frame minimizes vibration, maintaining stable, consistent performance in high-volume wire bonding lines.
Key Advantages
-
Ultra-Precise KOZ Control: Guarantee accurate glue placement within a 10μm tolerance, safeguarding gold wire loops and preventing accidental bending or damage.
-
Consistent, Even Glue Dispensing: Advanced valve control and visual inspection ensure every encapsulation is uniform, preventing underfill or overflow that could compromise wire integrity.
-
Real-Time Visual Positioning: Integrated mark recognition and product appearance alignment enable adaptive path correction for complex wire patterns.
-
Low-Level Alarm Module: Proactively alerts operators when adhesive supply is low, minimizing downtime and avoiding incomplete encapsulations.
Typical Applications
✔ Gold Wire Encapsulation for Wire Bonding
✔ KOZ-Controlled Underfill for Semiconductor Packaging
✔ Fine-Pitch Die Attach Encapsulation
✔ ASIC and MEMS Chip Bonding Protection
✔ SMD Reinforcement and Potting
✔ Micro Sensor Wire Loop Protection
Key Specifications
|
Motion System
|
Transmission System
|
X/Y: Linear motor
Z: Servo motor&Screw module
|
|
Max. Dispensing Range
|
X*Y: 280*170mm (Single track) --with loaing & unloading
|
|
X*Y: 360*520mm/ 360*215mm (Single/ Double track) -- w/o loading & unloading
|
|
Effective travel
|
X*Y: 380*610mm
|
|
Repeatability (3 sigma)
|
X/Y≤±10μm, Z≤±10μm
|
|
Positioning Accuracy
|
X/Y≤±15μm, Z≤±15μm
|
|
Max. Speed
|
X/Y: 1300mm/s, Z: 500mm/s
|
|
Max. Acceleration
|
X/Y: 1.3g, Z: 0.5g
|
|
Correction System
|
Visual Positioning Method
|
Mark/ Product Appearance
|
|
Fly-align Positioning
|
max: 300m/s
|
|
Laser Altimetry
|
Measurement Range: ±5 mm, Repeatability Accuracy 1μm,
Sampling Frequency: 2k
|
|
Track System
|
Number of Tracks
|
Single track / Double tracks
|
|
Track Parallelism
|
Widest to Narrowest: < 0.1 mm
|
|
Width Adjustment Range
|
40-170mm
|
|
Side Pushing Accuracy
|
≤0.02mm
|
|
Loading & Unloading Module
|
Suspended loop-type / Floor-standing loop-type loading & unloading, Touchable screen teaching
|
FAQ
Q1: Why is KOZ control so critical for wire bonding?
A: Any glue overflow or misplacement can damage fine gold wires or cause electrical shorts. The GS600 series’s KOZ control ensures glue stays exactly where needed, protecting bond loops.
Q2: Can the GS600 series be used with UV-curable adhesives?
A: Yes. The system is compatible with a wide range of adhesives, including UV, epoxy, and underfill materials commonly used in semiconductor wire bonding.
Q3: Does the machine support high-mix production?
A: Absolutely. The system’s flexible configuration and recipe management allow fast model changeover, ideal for varied product runs.
Q4: How does it prevent whole line downtime?
A: Each track operates independently, and the conveyor track design separates maintenance areas — minimizing unplanned stops for the entire line.
Conclusion
Achieve unmatched precision, protect your gold wires, and meet the toughest encapsulation requirements — choose the GS600M for wire bonding encapsulation that sets your production apart.
Contact us for a custom demo and unlock next-level precision for your packaging line!
Product Tags:
|
|
5.0 - 7.0kg/Cm2 Electronic Dispensing Machine For Wire Bonding Gold Wire Encapsulation Images
|
